Description

The KTS1289 provides robust transient voltage suppression (TVS) for ESD and surge events that occur at a system’s USB or other DC power input or output port. The monolithic IC includes an active-clamp control circuit, a gate-driver, and a power MOSFET to provide higher performance in a smaller footprint compared to typical TVS diodes. The KTS1289 clamps both positive and negative ESD and surge events per IEC standards.

The maximum reverse working voltage and the breakdown voltage of KTS1289 are set appropriately just above the typical supply voltage. The active control circuit clamps the voltage nearly flat during ESD/Surge events while high current is shunted to ground through the integrated power MOSFET. Together, the tightly controlled breakdown voltage and the “flat-clamp” performance reduce the peak voltage seen by capacitors and downstream circuits, thereby easing system design and lowering costs.

The KTS1289 is packaged in advanced, fully “green” compliant, 1. 66mm x 1.56mm, 6-bump Wafer-Level Chip-Scale Package (WLCSP) or FCDFN22-6 Package.

Features

  • Up to ±200V Surge Protection (IEC61000-4-5)
  • ±30kV ESD Contact & Air-Gap (IEC61000-4-2)
  • 28VIN(TYP) for EPR 28V system (VRWM = 33V)
  • Max clamping voltage of 39V at 80A of 8/20µs Surge Current
  • -40°C to 85°C Operating Temperature Range
  • 6-bump WLCSP 1.66 x 1.56mm (0.5mm pitch)
    • Can co-layout with TVS3300 WLCSP Package
  • 6-pin FCDFN 2mm x 2mm Package
    • Can co-layout with TVS3300 DFN Package

Applications

  • Any USB or DC Input or Output Power Port
  • Smartphones, Tablets, Computers, Docking Stations
  • Terminals, Monitors, Cameras, Instrumentation
  • Power-Banks, Generators, Rechargeable Devices

Packaging Information

Package Dimensions Package Code
WLCSP32-6 1.66mm x 1.56mm x 0.555mm CAE

Technical Documentation

Description Documents Type
DatasheetKTS1289-04bPDF
Package Outline DrawingWLCSP32-6 CAE PODPDF

Purchase

Purchase Options Coming Soon