Dual-channel Active Choke for EMI Suppression w/ Integrated ESD Protection

Features

  • Enables system designers to comply with:
    • CISPR22 and FCC Part 15, Class B requirements for Radiated and Conducted Emissions
    • IEC 61000-4-3 requirements for Radiated and Conducted Immunity, Level 3 or higher
    • IEC 61000-4-2 ESD (Air Discharge) of ±25kV
    • IEC 61000-4-2 ESD (Contact Discharge) of ±12kV
    • Cable Discharge Event (CDE) of ±12kV
  • Provides up to 10dB of additional common mode noise suppression over the frequency of 1MHz to 125MHz when used with Ethernet magnetics
  • Robust built-in ESD suppressors protect the Ethernet PHY and improve system ESD performance
  • JESD22-A114, ESD, HBM of ±8kV
  • Interfaces to standard Ethernet transformers and 10/100/1000 Ethernet PHYs
  • Uses a single standard power rail (3.3V or 2.5V)
  • Open drain output stage that can be biased from 1.8V to 3.3V using transformer center-tap supply as needed based on choice of Ethernet PHY
  • Flow-through routing for ease of board layout
  • Typical power consumption of 90mW
  • Low power mode available
  • Industrial temperature range (-40°C to +85°C)

Applications

  • Ethernet systems requiring additional CM suppression to meet EMC Class B emissions or higher EMI immunity requirements and ESD protection
  • PoE and Non-PoE Ethernet systems
  • VoIP Phones, IP Cameras, WAPs, Routers, Switches
  • Set Top Boxes, Networked Printers and Appliances, Desktop and Laptop Computers

Key Electrical Specifications

Vin

(Min)

 Vin

(Max)

  CISPR22  FCC Part 15 IEC 61000-4-3 requirements for Radiated and
 Conducted Immunity 		   IEC 61000-4-2  ESD (Air Discharge)  IEC 61000-4-2 ESD  (Contact Discharge) Cable Discharge   Event (CDE)  Package
 2.17V   or  3.13V   2.63V    or  3.47V Class B,

for Radiated

and   Conducted

Emissions

 Level 3 or higher ±25kV ±12kV ±12kV   QSOP-16L      (SOIC narrow), TDFN-4×2.5-16L

Typical Application Diagram